Duralco™ Thermally Conductive Adhesives and Potting Compounds  provide the heat dissipation required for many high temp. Electronic and Industrial Applications. These ultra temp. adhesives combine Cotronics’ unique polymer system with specialty conductive fillers to provide continuous service to 450ºF. Duralco™ Conductive Adhesives bond to glass, ceramics, metals and plastics, have excellent resistance to most chemicals and solvents and are ideal for all high temperature applications. Applications include solder replacement, semi conductor bonding, shielding, electronics, quick repairs, heat transfer, etc.

Highly conductive, ceramic filled, electrically resistant adhesive and potting compound. Just mix, apply and cure at room temperature. 128 is ideal for use in rectifiers, high power devices, semi-conductors, etc.

Aluminum metal filled epoxy that cures at room temp to form machinable, thermally conductive bond lines. Duralco 132 offers the maximum conductivity available in a 500ºF epoxy system. Can be supplied as a non-sag putty for heat tracing applications. Ideal for applications requiring rapid heating and cooling and can be used for any bonding, assembling, heat tacking applications.

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Duralco 133 is a two component, heat curing, Aluminum filled, Conductive epoxy. Suitable for high temp. tooling and applications requiring machinable repairs. Duralco 133 combines the excellent properties of Duralco 132 with Cotronics' higher temperature epoxy system to provide up to 600ºF service.

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More Epoxies
     Electrically Resistant  
     Encapsulants  
     Machinable  
     Twin Packs and Pre-Measured  
     Single Component  
     Electrically Conductive  
     Thermally Conductive  
     Ultra Temp.  

Custom Formulations Available Upon Request

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